1、 Basic performance requirements for titanium target materials
① Purity: As one of the main performance indicators of target materials, purity has a crucial impact on the performance of thin films. In practical applications, the requirements for the purity of target materials vary by industry. For example, in the microelectronics industry, with the continuous increase in silicon wafer size and the continuous decrease in wiring width, the requirements for target purity are also constantly increasing. Previously, a target purity of 99.995% could meet the process requirements of 0.35um IC, but now preparing 0.18um lines requires a target purity of 99.999% or even 99.9999%.
② Impurity content: Impurities in the solid of the target material and oxygen and water vapor in the pores are the main sources of pollution for depositing thin films. Therefore, the requirements for impurity content of target materials for different purposes are also different. For example, pure aluminum and aluminum alloy targets used in the semiconductor industry have special requirements for alkali metal content and radioactive element content.
③ Density: In order to reduce the pores in the solid target material and improve the performance of sputtered films, it is usually required that the target material has a high density. The density of the target material not only affects the sputtering rate, but also affects the electrical and optical properties of the thin film. In addition, increasing the density and strength of the target material can better withstand the thermal stress during the sputtering process. Therefore, density is also one of the key performance indicators of the target material.
④ Grain size and grain size distribution: Target materials are usually polycrystalline structures, with grain sizes ranging from micrometers to millimeters. For the same target material, the sputtering rate of targets with fine grains is usually faster than that of targets with coarse grains; The thickness distribution of thin films deposited by target sputtering with small differences in grain size (uniform distribution) is more uniform.
2、 Purity requirements for titanium target materials in different industries
① Titanium target materials used in integrated circuits: Integrated circuits require extremely high purity of titanium target materials, usually greater than 99.995%, to ensure the performance and stability of thin films.
② Titanium target materials used in flat panel displays: Flat panel displays include liquid crystal displays, plasma displays, electroluminescent displays, and field emission displays. These displays often use sputtering coating technology to deposit thin films during the manufacturing process. Among them, titanium target material is one of the important sputtering targets, and its purity usually needs to be greater than 99.9%.
In addition, titanium target materials can be widely used in high-tech fields such as electronics, information industry, home decoration, and automotive glass manufacturing. In these industries, titanium target materials are mainly used for coating surface panel displays of integrated circuits, flat panels, and other components, or as decorations and glass coatings. By optimizing the performance and purity of titanium target materials, different industries' demands for thin film performance and stability can be met.
